Contact
Product Department Contact Information
| Product Segment | Department ※B.G. ：Business Group B.U. ：Business Unit |
Tel |
|---|---|---|
| Capacitors | ||
| Multilayer Ceramic Chip Capacitors / Disc Type Capacitors with Lead (High Voltage Ceramic Capacitors) / MLCC with Dipped Radial Lead / 3-Terminal Feedthrough MLCCs / Ultra High Voltage Ceramic Capacitors / Feedthrough Ceramic Capacitors for Magnetron | Ceramic Capacitors B.G. | 86-021-6196-2345*1 |
| Aluminum Electrolytic Capacitors / Film Capacitors / Components for PFC and Harmonic Filtering / Power Capacitors | Aluminum & Film Capacitors B.G. | 86-021-2219-1500 |
| CeraLink® Capacitors | Piezo & Protection Devices B.G. | 86-021-2219-1500 |
| Electric Double-Layer Capacitors (EDLC / Supercapacitors) | Next Generation Products & Solutions Group | 86-021-2219-1500 |
| Inductors (Coils) | ||
| Inductors (Coils) / Transponder Coils | MagneticsB.G. | 86-021-6196-2345*1 |
| EMC Components | ||
| Chip Beads / Noise Suppression Filters / 3-terminal Filters (except YFF Series) / Common Mode Filters / Chokes / Clamp Filters (Ferrite Core with Case) / Power Line Chokes / Ferrites For EMC Suppression | Magnetics B.G. | 86-021-6196-2345*1 |
| 3-terminal Filters (YFF Series) / Noise Absorbers | Ceramic Capacitors B.G. | 86-021-6196-2345*1 |
| Noise Suppression Sheets | Communication Devices B.G. | 86-021-6196-2345*1 |
| Power Line EMC Filters | TDK-Lambda | 86-021-6196-2345*1 |
| RF Components | ||
| Filters / Diplexers / Triplexers / Baluns (except ATB Series) / irectional Couplers / Dividers / Splitters / hip Antennas / Isolators / Circulators | Communication Devices B.G. | 86-021-6196-2345*1 |
| Baluns (ATB Series) | Magnetics B.G. | 86-021-6196-2345*1 |
| Voltage / Current / Temperature Protection Devices | ||
| ESD/ Surge Protection Devices（except Ring Varistors） / Current Protection Devices / Temperature Protection Devices | Piezo & Protection Devices B.G. | 86-021-6196-2345*1 |
| Ring Varistors | Ceramic Capacitors B.G. | 86-021-6196-2345*1 |
| Sensors and Sensor Systems | ||
| Temperature Sensors (NTC) (except Chip NTC thermistors) / Pressure Sensor Dies / Pressure Sensor Transmitters | Temperature & Pressure Sensors B.G. | 86-021-6196-2345*1 |
| Chip NTC thermistors / Temperature Sensors (PTC) / Level Sensors / Humidity Sensors / Surface Potential Sensors / Toner Density / Quantity Sensors | Piezo & Protection Devices B.G. | 86-021-6196-2345*1 |
| Clamp AC Current Sensors | Magnetics B.G. | 86-021-6196-2345*1 |
| TMR Angle Sensor / Gear Tooth Sensors | Magnetic Sensors B.G. | 86-021-6196-2375 |
| Magnetic Current Sensors / Linear Hall Sensors / Hall Switches / Direct Angle Sensors / Embedded Motor Controllers | Magnetic Sensors B.G. / TDK-Micronas | 86-021-6196-2377 |
| IMU (Inertial Measurement Unit) / Acceleration Sensors / Gyroscopes / Barometric Pressure Sensors / Ultrasonic ToF (Time-of-Flight) Sensors | MEMS Sensors B.G. / InvenSense | 86-021-6863-9668 |
| Acceleration Sensors / Gyroscopes (Tronics Brand) | Temperature & Pressure Sensors B.G. | 86-021-6863-9668 |
| Ultrasonic Sensor Disks | Piezo & Protection Devices B.G. | 86-021-6863-9668 |
| Ceramic Switching / Heating Piezo Components Buzzers and Microphones | ||
| Ceramic Switching / Heating Piezo Components Buzzers and Microphones (expect MEMS Microphones) | Piezo & Protection Devices B.G. | 86-021-6196-2345*1 |
| MEMS Microphones | MEMS Sensors B.G. / InvenSense | 86-021-6863-9668 |
| Transformers | ||
| Transformers for IGBT/FET / Transformers for BMS / Current Sense Transformers / Transformers for AC-DC Converters / Choke Coils for PFC / Step-up Transformers / Pulse Transformers and Modules for LAN | Magnetics B.G. | 86-021-6196-2345*1 |
| Ferrites | ||
| Ferrite Cores | Magnetics B.G. | 86-021-6196-2345*1 |
| Noise Suppressing / Magnetic Sheets | ||
| Noise Suppression Sheets / Wireless Power Transfer / NFC Antennas Sheets (Shield) | Communication Devices B.G. | 86-021-6196-2345*1 |
| Anechoic Chambers and Radio Wave Absorbers | ||
| Anechoic Chambers / Radio Wave Absorbers / EMC Measurement Systems | EMC & RF Engineering BD | 86-0512-6807-5953 |
| Power Supplies | ||
| AC-DC Power Supplies / DC-DC Converters/ Programmable Power Supplies / Bidirectional Converters / Programmable Electronic Loads / Accessories | TDK-Lambda | 86-021-6485-0777 |
| µPOL™ Embedded DC-DC Converters | Communication Devices B.G. | 86-021-6196-2345*1 |
| Power supply for xEV | Energy Devices B.G. | 86-021-6196-2345*1 |
| Magnets | ||
| Ferrite Magnets / Neodymium Magnets | Magnet Products B.G. | 86-021-61962406 |
| Flash Storages | ||
| NAND-type Flash Memory Controller GBDriver / CompactFlash™ Card / CFast™ / 2.5 inch SSD Parallel ATA (PATA) / 2.5-inch SSD Serial ATA (SATA) II/III / Half Slim SSD Serial ATA (SATA) III / mSATA SSD Serial ATA (SATA) III / M.2 SSD Serial ATA(SATA) III / SD Memory Card/microSD Memory Card / embedded SD/embedded SSD | Flash Memory Applied Devices | 86-021-6196-2375 |
| SD Memory Card/microSD Memory Card / embedded SD/embedded SSD" | Flash Memory Applied Devices | 86-021-6196-2375 |
| Wireless Power Transfer | ||
| Tx Coil Units and Modules/ Rx Coil Units and Modules / NFC Antenna Combo Rx Coil Units / Wireless Power Transfer / NFC Antennas Sheets (Wireless) | Communication Devices B.G. | 86-021-6196-2345*1 |
| Industrial Equipment System | TDK-Lambda | 86-021-6485-0777 |
| FA Systems | ||
| FOUP Load Port / Flip Chip Bonding System | Production Engineering Center | 886-3571-2233 |
| Transparent Conductive Film | ||
| Applied Film B.U. | 86-021-6196-2375 | |
| Solar cells | ||
| Package & Foundry BD | 86-021-6196-2375 | |
| Solid-State Batteries | ||
| SMD Solid-State Batteries | Piezo & Protection Devices B.G. | 86-021-2219-1500 |